Bond Pad (W x L)=75umx75um
Chip Dimensions (WxLxH)=220umx200umx95um
Thickness tolerance ± 15um
Lateral Dimension tolerance ± 25um
Parrameters | Unit | Min. | Max. | |
Forward Current(25℃) | mA | -- | 150 | |
Forward Power(25℃) | mW | -- | 40 | |
Reverse Voltage | V | -- | 2 | |
Storage Temperature | ℃ | -40 | +100 |
Parameters at 25°C unless otherwise specified
Parameter | Symbol | Test Conditions | Min. | Typical | Max. | Unit |
Operating Temperature | T | Please see the Ordering Information | ℃ | |||
Threshold Current | ITH | CW | -- | 10 | 14 | mA |
T=85℃ CW | -- | 30 | ||||
Optical Output Power | PO | IF= ITH+20mA | 6 | 7 | -- | mW |
T=85°C ITH+20mA | 3.6 | 4 | -- | |||
Slope Efficiency | SE | ITH+20mA | 0.3 | 0.35 | W/A | |
T=85°C ITH+20mA | 0.18 | 0.2 | ||||
Forward Voltage | VF | IF= ITH+20mA | 1.6 | V | ||
Series Resistance | R | IF= ITH+20mA | 10 | 14 | Ohm | |
Center Wavelength | λ | IF=ITH+20mA T=25℃ | 1480 | 1490 | 1500 | nm |
Wavelength Temp Coefficient | dλ/dT | T=-20℃~+85℃ | 0.09 | nm/℃ | ||
Side Mode Supp Ratio | SMSR | IF=ITH+20mA | 35 | 40 | dB | |
Rise Time | TR | unfiltered, 10~90% | 100 | ps | ||
Fall Time | TF | 150 | ps | |||
Far field(Vertical) | ɵv | IF=ITH+20mA | 40 | degrees | ||
Far field(Horizontal) | ɵh | IF=ITH+20mA | 25 | degrees | ||
Small Signal Modulation Bandwidth(3dB) | BW | IF=ITH+20mA | 9 | GHz |
Muli Quantum Well Distributed Foecoack Laser
1490nm wavelength
Direct modulation beyond 2.5 Gbps
Designed for Telcordia GR.468
◆FTTR